
Phones powered by Mediatek will soon have the fastest 5G. The Dimensity 1050, Mediatek’s first system-on-chip (SoC) enabling the fastest flavor of 5G, joins the mmWave 5G party.
The MediaTek Dimensity 1050 is the latest addition to MediaTek’s mobile chipset range. The key point of this chipset is that it is the company’s first chipset to support dual mmWave and sub-6GHz 5G connection, however it is still a lower-specced version of the Dimensity 1100.
- The Dimensity 1050 is Mediatek’s first mmWave 5G SoC.
- The new chip will flip between mmWave and slower sub-6GHz 5G flawlessly.
- Mediatek will use TSMC’s 6nm manufacturing technology.
The current wireless generation is divided into several kinds. The fastest 5G is mmWave, which uses 6GHz and higher spectrum to give gigabit speeds. Unfortunately, mmWave has a very limited range and penetration through buildings. As a result, devices that support mmWave must additionally support sub-6GHz spectrum to offer coverage in places outside the range of mmWave.
“The Dimensity 1050, and its combination of sub-6GHz and mmWave technologies, will deliver end-to-end 5G experiences, uninterrupted connectivity, and superior power efficiency to meet everyday user demands,” said CH Chen, Deputy General Manager of Wireless Communications Business Unit at Mediatek. “With faster, more reliable connections, and advanced camera technology, this chip delivers powerful features to help device makers to differentiate their smartphone product lines.”

The MediaTek Dimensity 1050 is an octa-core processor based on a 6nm technology. Two ARM Cortex A-78 performance cores clocked at 2.5GHz are included. Unfortunately, the press release makes no mention of the efficiency cores, although it is fair to assume that the chipset employs ARM Cortex-A55 cores. The ARM Mali-G610 is in charge of graphics and games. You’ll also receive MediaTek’s HyperEngine 5.0 suite, which includes more optimization tools and capabilities for improved gaming performance.
Specifications | MediaTek Dimensity 1050 |
---|---|
CPU | 2x Arm Cortex-A78 @ 2.5GHz6x Arm Cortex-A55 @ ? |
GPU | Arm Mali Mali-G710 GPUMediaTek HyperEngine 5.0 |
Display | Maximum On-Device Display support: FHD+ @ 144Hz |
Memory | LPDDR5UFS 3.1 |
ISP | MediaTek Imagiq 760 ISPUp to 108MP main cameraDual HDR Video Capture Engine |
Modem | Integrated multimode 5G/4G modemmmWave + sub6Hz 5G support4CC/3CC Carrier Aggregation |
Connectivity | Bluetooth 5Wi-Fi 6E 2×2Beidou III-B1C GNSS support |
Manufacturing process | 6nm-class |
The Dimensity 1050 also supports Full HD+ screens with a refresh rate of up to 144Hz. In addition, you’ll receive hardware-accelerated AV1 video decoding, HDR10+ playback, and Dolby Vision compatibility.
On the sub-6GHz (FR1) frequency, the MediaTek Dimensity 1050 supports 3CC carrier aggregation, while on the mmWave (FR2) band, it supports 4CC carrier aggregation. When compared to LTE+ mmWave aggregation, this allows the chipset to offer up to 53% higher downlink rates. For ultrafast Wi-Fi access, the chipset also supports Wi-Fi 6E and 2×2 MIMO antenna.

The main highlight of this chip is support for mmWave 5G. This faster form of 5G is a huge thing for US carriers, and MediaTek’s support for mmWave makes phones powered by the company’s chips more appealing to those providers. The chip especially supports the n257, n258, n260, and n261 bands.
The first smartphones using the processor will be available in Q3 2022.
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